About: Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration

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Author	Lissorgues, Gaëlle (19..-....) Rousseau, Lionel (1972-....) Bourouina, Tarik (19..-....) Phommahaxay, Alain (1981-....) Nicole, Pierre (19..-....)
Bibliographic Citation	Phommahaxay Alain, Lissorgues Gaelle, Rousseau Lionel, Perrais Vincent, Bourouina Tarik, Nicole Pierre, Marty Frédéric. Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration. Transducers 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, Jun 2007, Lyon, France. pp.2063-2066, ⟨10.1109/SENSOR.2007.4300570⟩
Title	Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration
dc:date	2007
Digital Object Identifier (DOI)	10.1109/SENSOR.2007.4300570

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